design services
Regardless of whether your project is large or small, complex or simple, well-defined by specs or just in the concept phase, Kapik is ready and willing to meet your needs. We can assist you in creating the type of fast, low-power smart analog and mixed signal design you need, including:
- Circuit blocks
- Subsystems
- Full chips
- Multi-chip systems
Representative Design Projects:
- Capacitive Multi-touch panel controller IC (including embedded microcode)
- Thermal Finger print sensor panel control IC
- MEMS motion sensor controller IC: 3D gyroscope
- Battery charge monitor IC (16b delta-sigma ADC; on-chip oscillator)
- Ultrafast AFE (for next gen fiber optic links)
- 5GS/s RF DAC (for Wi-gig)
- Charge pump for OTP memories
- Integrated GaN cascode high current driver IC: 20A
Our strength is in creating systems and full chips. From a blank sheet we’ve designed:
- MEMS: sensor to module
- Multi-touch panel: sensor to module
- Fiber telecom: ADC to FFT
- Power systems: I/V sensing, high voltage/current
Our team’s expertise is multi-disciplinary, spanning:
- RF systems
- Audio /Electro-acoustics
- Sensors
- Digital + Analog
We also bring to the table a range of technology experience including:
- 22, 28, 40, 55, 65, 180, 800nm CMOS and 250GHz SiGe, 160nm HV, 180nm HV, 180nm HV SOI
- TSMC, IBM, Silterra, STM, Dalsa, XFAB, Global Foundries